VARINDIA IT MAGAZINE

HID Global has expanded its broad offering of its identity assurance portfolio with the addition of the ActivID Flexi Token.  The new solution is ideal for financial institutions and enterprises seeking a cost-effective pin pad solution with advanced security capabilities for mass deployment.  The hardware token offers a more flexible solution for graphical customization and deployment, along with options for on-site initialization to further protect data and enhance security programming. Tim Phipps, Vice President of product marketing, HID Global, said,  “Our banking and enterprise customers now have another OTP token option as part of an end-to-end solution that delivers one of the industry’s best possible out-of-the-box experiences. The new tokens can be used with our ActivID authentication system without requiring equipment to be replaced or updated.  These solutions offer the flexibility to graphically customize each side of the product and initialization at the customer prem

HID Global has announced an ultra-thin Polycarbonate (PC) ePrelaminate inlay for electronic ID (e-ID) cards that is more than 30 percent thinner than alternatives.  The new offering is the first HID Global inlay to use its patented HID direct bonding platform technology, which is available for high frequency (HF) systems. NXP Semiconductors is HID Global’s first qualified partner supplying IC chips for this product. HID Global’s new inlay takes advantage of its proven process of directly bonding chips to wire-embedded air-coil antennae for low-frequency animal ID and automotive applications, without the bulk of added modules. The company has successfully leveraged its direct bonding technology for HF applications, enabling manufacturers to develop the smallest HF formats available in the market while delivering uncompromised performance. By using this method in its new ultra-thin inlays, HID Global is providing smart cards with a durable and reliable connection between the card