Posts

Showing posts with the label Epan Wu

VIA Magic Box unveiled

Image
VARINDIA- INDIA'S FRONTLINE IT MAGAZINE   VIA  has announced its Magic Box, a complete hardware and software solution for dynamic digital signage. It is said to integrate the user friendly VIA Magic View content management software optimized for a range of VIA x86 hardware platforms to provide a high performance, scalable digital signage solution ideal for a wide range of user scenarios. VIA Magic Box  is available in two versions, VIA Magic Box Standalone version.... more

VIA rolls out QuadCore Pico-ITX Board

Image
VARINDIA- INDIA'S FRONTLINE IT MAGAZINE   VIA has unveiled VIA EPIA-P910 Pico-ITX board. It is believed to be the first VIA board to include the VIA VX11H MSP in combination with a VIA QuadCore E-Series processor.  The newly launched provides DirectX 11 support along with 3D stereoscopic display and HDMI and USB 3.0 features. Epan Wu, Head, Embedded Platform Division, VIA Technologies..... more

Android supports ARM Digital Signage System

Image
VARINDIA- INDIA'S FRONTLINE IT MAGAZINE   VIA Technologies Inc. has released the VIA ARM DS (Digital Signage) system. Developed for the Android operating system, the VIA ARM DS is an all-in-one system-ready solution for managing dynamic displays for cost sensitive high volume segments where high performance video and connectivity are paramount for enhanced customer engagement. Applications range from kiosks, POS systems, video walls, and menu boards to TVOIP, cloud streaming, and Out of Home Advertising across a broad spectrum of retail, hospitality, education, and entertainment environments. Epan Wu, Head - VIA Embedded Platform Division said, “The VIA ARM DS system extends the familiarity of Android to dynamic digital signage displays, providing a cost-effective alternative to other products on the market. We welcome 3rd party software and system integration partners to join us to develop customized solutions based on the system.” For More Details See www.varindia....

VIA unveils Latest COM Express

Image
VARINDIA- INDIA'S FRONTLINE IT MAGAZINE VIA Technologies has announced the latest VIA COMe-8X90 module, featuring 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). Measuring 95mm x 125mm, COM (Computer-on-Module) Express is an embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. Along with the VIA COMe-8X90module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions. "Embedded modules are ideal for creating highly tailored solutions with a short time to market approach. The VIA COMe-8X90m...